Dear Partner,

I hope this email finds you well. We are excited to extend an invitation to your students to participate in the Tohoku University Engineering Summer Program (TESP) 2025. This program offers a unique opportunity for students to immerse themselves in a dynamic academic and cultural experience at one of Japan’s leading institutions.

In our ongoing efforts to strengthen existing research collaborations with your institution, we highly recommend and emphasize the Materials Engineering course- Bio-Materials Engineering (coordinated by Prof. Masaya Yamamoto, Assis. prof. Mako Kobayashi) and encourage you to actively promote student applications for this specific course.

Program Highlights:

– Engineering courses taught by Tohoku professors
– Hands-on laboratory sessions and group project
– Cultural & social activities to explore the city & Tohoku region
– Networking opportunities with students from around the world

Program Details (Materials Engineering Course):

Dates: July 10 to July 25, 2025
Fee: 50,000 JPY
Location: Tohoku University, Sendai, Japan
Application deadline: April 19

To facilitate the participation of your students, please visit our program website: https://www.ied.eng.tohoku.ac.jp/en/summer-program

Should you have any questions or require further details, please feel free to contact us.
We look forward to welcoming your students to Tohoku University for a memorable and enriching summer experience.